MetaWells, together with its parent company PANJIT, will exhibit at electronica Shanghai 2026. PANJIT Group will showcase its dual-core strategic focus on "Automotive Electronics" and "AI Server" applications, demonstrating the Group's fully integrated capabilities spanning component design, packaging testing, and system-level applications, and outlining a future blueprint for high-efficiency, high-reliability power electronics technologies for the industry.
MetaWells will station its professional technical and sales teams at the exhibition site, working closely with PANJIT to enhance customer service. The teams will provide timely responses to automotive and server customers' critical needs for supply chain resilience and localized support, further strengthening the Group's service presence in the China market.
In the automotive sector, PANJIT will showcase its comprehensive portfolio covering 48V systems, automotive-grade protection components, and advanced SiC solutions, addressing key applications including electronic power steering, battery management systems, electric drive systems, and ADAS. For AI servers facing high computing power challenges, the company will feature Wide SOA high-performance MOSFETs suitable for hot-swap applications, along with high-density packaging solutions designed to mitigate failure risks and significantly reduce operational losses.
To provide a clear demonstration of technical capabilities, a dynamic testing area will be set up on-site, allowing engineers to observe the superior thermal performance of the components through live instrument measurements. In addition, sample displays of advanced packaging technologies, including Full-Cu Clip, DSC dual-sided cooling, and SWF packages, will be presented. High reliability, high power density, and high-performance packaging are the standout technical strengths that PANJIT and MetaWells will showcase at this exhibition. Industry professionals, partners, and engineers are cordially invited to visit the booth for in-depth discussions and exchanges with the technical teams.
